Wednesday, April 15, 2009

New iPhone Parts List Leaked

iPhone Parts List
Digitimes is showing us a list of parts for upcoming iPhone and their respective manufacturers in an article mentioning who in Taiwan going to benefit from the much hyped and awaited phone.
If the list is right, there will be Memory and flash from Toshiba, Numonyx, SST and Samsung. WCDMA, GSM EDGA amps coming from Triquint and Skyworks. Infineon will provide baseband and A-GPS in addition to Power management IC. Omnivision will give the 3.2 megapixel CIS camera.

"TSMC have landed foundry orders for GSM EDGE power amplifiers, Bluetooth ICs and 3.2-megapixel OmniVision CMOS image sensor (CIS) used in the upcoming iPhone model, indicated the sources. Xintec will handle the packaging and testing service for the CIS whereas VisEra will manufacture on-chip color filters for the CIS. TSMC, Xintec and VisEra declined to comment on the report, citing customer confidentiality. "


Blog Widget by LinkWithin